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  • Acoustic Functional Materials and Devices: From Wave Physics to Engineering Applications

Acoustic Functional Materials and Devices: From Wave Physics to Engineering Applications

Submission Deadline: March 18, 2027Contribute to this Special Topic

Decorative ImageAcoustics is experiencing a renaissance driven by the convergence of wave physics, functional materials, and advanced manufacturing. Engineered acoustic materials and devices now deliver capabilities once considered unattainable deep-subwavelength sound absorption and insulation, precise wavefront and dispersion engineering, non-reciprocal and topologically protected wave transport, and reconfigurable or intelligent acoustic functionalities. Crucially, these advances are moving beyond proof-of-concept demonstrations toward engineering practice in noise and vibration control, architectural and environmental acoustics, ultrasound imaging, underwater acoustics, acoustofluidics, and acoustic sensing and communication.

This Special Topic showcases recent advances at the interface between fundamental wave physics and the engineering of acoustic materials, devices, and systems. Topics of interest include, but are not limited to: functional materials and structures for sound absorption, insulation, and ventilated noise control; acoustic metamaterials and metasurfaces; topological, non-Hermitian, and non-reciprocal acoustics; active, programmable, and intelligent acoustic devices; machine learning-assisted acoustic design; acoustofluidics and ultrasonic devices; and underwater, structural, and vibro-acoustics.

Topics covered include, but are not limited to:

  • Sound Absorption, Insulation, and Noise Control
  • Acoustic Functional Materials and Metasurfaces
  • Topological, Non-Hermitian, and Non-reciprocal Acoustics
  • Elastic Wave Engineering and Phononic Structures
  • Acoustofluidics, Acoustic Tweezers, and Ultrasonic Devices

Guest Editors:

Prof. Yegao Qu, Shanghai Jiao Tong University, China

Prof. Yong Li, Tongji University, China

Dr. Sibo Huang, Shanghai Jiao Tong University, China

Dr. Zhendong Li, Central South University, China

Dr. Sichao Qu, The University of Hong Kong, Hong Kong SAR, China

Submission Deadline: March 18, 2027Contribute to this Special Topic
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